Process Hierarchy

on front
  Microscope inspection
Batch size 1
Magnifications 5, 10, 20, 50, 100
Process duration 30 min
Sides processed either
Wafer size
Wafer size
Equipment Olympus microscope
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
recessed platen
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, gallium arsenide, silicon on sapphire, sapphire, glass (category), quartz (single crystal)
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 10000 µm