Process Hierarchy

on front
  Photoresist softbake
Material photoresist (category)
Setup time 30 min
Sides processed either
Temperature 90 °C
Wafer size
Wafer size
Equipment SVG 8600 Photoresist Coat Track
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
vacuum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 700 µm