Process Hierarchy

  Photoresist hardbake (110 degC)
Ambient to which substrate is exposed during processing
Batch size 1
Pressure of process chamber during processing
1 atm
Sides processed both
Temperature 110 °C
Thermal duration 30 min
Wafer size
Wafer size
Equipment Oven
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat
Wafer holder
Device that holds the wafers during processing.
wafer boat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
quartz (single crystal), silicon on insulator, silicon, Pyrex (Corning 7740)
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 2000 µm
  • Developed photoresist coated wafer.