Process Hierarchy

on front
  Photoresist coat (Shipley 220)
Batch size 25
Material Shipley 220
Process duration 100 min
Sides processed either
Temperature 90 °C
Thickness 7 µm
Wafer size
Wafer size
Equipment SVG Autocoater 8626
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
vacuum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon, glass (category), quartz (single crystal), silicon on sapphire, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 550 µm
  • Requires dehydration bake process prior to coat.