|
Pressure Pressure of process chamber during processing |
1 atm |
Sides processed |
both |
Temperature |
1000 °C |
Wafer size |
|
Equipment |
Thermco TMX furnace (B-stack) |
Equipment characteristics: |
Wafer holder Device that holds the wafers during processing. |
quartz boat |
Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |
Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 530 µm |
Comments: |
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