Process Hierarchy

  Phosphorus drive-in
Pressure of process chamber during processing
1 atm
Sides processed both
Temperature 1000 °C
Wafer size
Wafer size
Equipment Thermco TMX furnace (B-stack)
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
quartz boat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 530 µm
  • Consistent with a limited-source phosphorus diffusion.
  • Phosphorus predeposition.