Process Hierarchy

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  Titanium E-beam evaporation
Process characteristics:
Thickness of material to be deposited.
Thickness of material to be deposited., must be 0 .. 0.1 µm
0 .. 0.1 µm
Material titanium
Sides processed either
Wafer size
Wafer size
Equipment Temescal evaporator
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
no-flat, 1-flat, 2-flat, notched
Wafer holder
Device that holds the wafers during processing.
mechanical clamp
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
glass (category), Pyrex (Corning 7740), quartz (single crystal), silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
0 .. 1500 µm