Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Ultrasonic clean
Batch size 1
Process duration 5 min
Temperature 20 °C
Wafer size
Wafer size
Equipment Ultrasonic Cleaner
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
 no-flat, 1-flat, 2-flat, notched
Wafer holder
Device that holds the wafers during processing.
 teflon cassette
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon, Borofloat (Schott), glass (category), silicon on insulator, Pyrex (Corning 7740), quartz (single crystal)
Wafer thickness
List or range of wafer thicknesses the tool can accept
 100 .. 500 µm