on front Photoresist Spin Coat ACS200 (AZ 5214E) |
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| Process characteristics: |
| Thickness |
|
|---|
| Material |
AZ 5214e |
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| Sides processed |
either |
|---|
| Temperature |
110 °C |
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| Wafer size |
|
|---|
| Equipment |
Suss ACS200 Wafer Coater / Developer |
| Equipment characteristics: |
| Batch sizes |
100 mm: 25, 150 mm: 25, 75 mm: 25 |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
cassette |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon on insulator, silicon |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
274 .. 700 µm |
|---|
