Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Resist bond
Batch size 1
Wafer size
Wafer size
Equipment Silicon organic wet bench
Equipment characteristics:
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon, glass (category)
Wafer thickness
List or range of wafer thicknesses the tool can accept
 50 .. 1000 µm
Comments:
  • Wafers brought into contact, no alignment.