Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Photoresist coat (Shipley 1813)
Process characteristics:
Thickness
Amount of material added to a wafer
Thickness*
Amount of material added to a wafer, must be 1.3 .. 2.5 µm
1.3 .. 2.5 µm
Batch size 1
Excluded materials gold (category), copper
Material Shipley 1813
Sides processed either
Wafer size
Wafer size
Equipment Solitec 5110-C
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
 teflon
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon, silicon dioxide, alumina
Wafer thickness
List or range of wafer thicknesses the tool can accept
 300 .. 1000 µm
Extra terms
Customer agrees that wafers, masks, and other materials incorporating any process(es) provided by this fabrication site are to be used solely for non-commercial research purposes.