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About MEMS
Rapid thermal anneal: View
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Anneal
Bake
Oxidation
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
Rapid thermal anneal
Process characteristics:
Ambient
Preferred annealing environment (if known).
Ambient
Available
air
helium
hydrogen
nitrogen
other
oxygen
steam
Selected
argon
Preferred annealing environment (if known).
Pressure
Preferred annealing chamber pressure (if known).
Pressure
atm
bar
mTorr
Pa
Preferred annealing chamber pressure (if known).
unconstrained
Process duration
Specify preferred annealing time (if known).
Process duration
min
s
Specify preferred annealing time (if known).
unconstrained
Temperature
Preferred annealing temperature (if known).
Temperature
°C
Preferred annealing temperature (if known).
unconstrained
Sides processed
both
Equipment