on front Photoresist ashing |
|
| Etchant Solutions and their concentrations. |
oxygen |
|---|
| Material |
photoresist (category) |
|---|
| Process duration |
30 min |
|---|
| Sides processed |
either |
|---|
| Temperature |
25 °C |
|---|
| Wafer size |
|
|---|
| Equipment |
Technic Micro RIE 800
|
| Equipment characteristics: |
| Batch sizes |
100 mm: 2, 150 mm: 1, 200 mm: 1, 75 mm: 4 |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
|---|
| Wafer holder Device that holds the wafers during processing. |
plate |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
glass (category), silicon, silicon on insulator |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |
|---|
