Process Hierarchy

on front
  Photoresist ashing
Solutions and their concentrations.
Material photoresist (category)
Process duration 30 min
Sides processed either
Temperature 25 °C
Wafer size
Wafer size
Equipment Technic Micro RIE 800
  • 200W O2 plasma
Equipment characteristics:
Batch sizes 100 mm: 2, 150 mm: 1, 200 mm: 1, 75 mm: 4
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
glass (category), silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1000 µm