Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Wafer dicing
Process characteristics:
Cuts per wafer
Number of cuts per wafer
Cuts per wafer
Number of cuts per wafer , must be 1 .. 1000
1 .. 1000
Die separation (X-direction)
The distance between cuts in X-direction.
Die separation (X-direction)
The distance between cuts in X-direction., must be 50 .. 100000 µm
50 .. 100000 µm
Die separation (Y-direction)
The distance between cuts in Y-direction.
Die separation (Y-direction)
The distance between cuts in Y-direction., must be 50 .. 100000 µm
50 .. 100000 µm
Wafer size
Wafer size
Equipment ADT7134
Equipment characteristics:
Batch sizes 50 .. 300 mm: 1
MOS clean no
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon on insulator, fused silica, gallium arsenide, quartz (fused silica), silicon, Borofloat (Schott), glass (Hoya)
Wafer thickness
List or range of wafer thicknesses the tool can accept
 300 .. 2000 µm
Comments:
  • Assume 1 to 5 wafers (Discount for larger quantity)
  • Exact pricing depends on the dicing requirements. Please include a picture or an image of the wafers with the dicing lines.