Process Hierarchy

  Wafer dicing
Process characteristics:
Cuts per wafer
Number of cuts per wafer
Cuts per wafer
Number of cuts per wafer , must be 1 .. 1000
1 .. 1000
Die separation (X-direction)
The distance between cuts in X-direction.
Die separation (X-direction)
The distance between cuts in X-direction., must be 50 .. 100000 µm
50 .. 100000 µm
Die separation (Y-direction)
The distance between cuts in Y-direction.
Die separation (Y-direction)
The distance between cuts in Y-direction., must be 50 .. 100000 µm
50 .. 100000 µm
Wafer size
Wafer size
Equipment K&S 798 Automatic 8 inch wafer saw
Equipment characteristics:
Batch sizes 25 .. 200 mm: 1
MOS clean no
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer holder
Device that holds the wafers during processing.
vacuum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
fused silica, gallium arsenide, glass (category), Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
50 .. 1000 µm
Comments:
  • Assume 1 to 5 wafers (Discount for larger quantity)
  • Exact pricing depends on the dicing requirements. Please include a picture or an image of the wafers with the dicing lines.