Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Photoresist coat (spoke pattern Shipley 1827)
Batch size 1
Material Shipley 1827
Sides processed either
Thickness 2.7 µm
Wafer size
Wafer size
Equipment Silicon organic wet bench
Equipment characteristics:
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon, glass (category)
Wafer thickness
List or range of wafer thicknesses the tool can accept
 50 .. 1000 µm
Comments:
  • Spoke pattern resist coat for resist bonding (allows gas to escape from bonded area).