on front Photoresist coat (spoke pattern Shipley 1827) |
|
| Batch size |
1 |
|---|
| Material |
Shipley 1827 |
|---|
| Sides processed |
either |
|---|
| Thickness |
2.7 µm |
|---|
| Wafer size |
|
|---|
| Equipment |
Silicon organic wet bench |
| Equipment characteristics: |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, glass (category) |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
50 .. 1000 µm |
|---|
| Comments: |
|
