Process Hierarchy

on front
  Photoresist coat (Shipley 1818)
Process characteristics:
Amount of material added to a wafer
Amount of material added to a wafer, must be 1.4 .. 2.1 µm
1.4 .. 2.1 µm
Material Shipley 1818
Sides processed either
Wafer size
Wafer size
Equipment Spinner
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
no-flat, 1-flat, 2-flat, notched
Wafer holder
Device that holds the wafers during processing.
vacuum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
glass (category), Pyrex (Corning 7740), quartz (single crystal), silicon, Borofloat (Schott), silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 500 µm