Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Application of adhesion promoter (MEOPTS)
Batch size 1
Material 97% 3-Methacryloxypropyltriethoxyline
Sides processed both
Wafer size
Wafer size
Equipment Hood #1
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
 no-flat, 1-flat, 2-flat, notched
Wafer holder
Device that holds the wafers during processing.
 teflon
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 glass (category), Pyrex (Corning 7740), quartz (single crystal), silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
 100 .. 500 µm
Comments:
  • Deposition from aqueous alcohol solution is the most facile method for preparing silylated surfaces. A 95% ethanol-5% water solution is adjusted to pH 4.5-5.5 with acetic acid. Silane is added with stirring to yield a 2% final concentration. Five minutes should be allowed for hydrolysis and silanol formation. When both sides need to be processed, the sample is dipped into the solution. Cure of the silane layer is for 5-10 minutes at 110oC or 24 hours at room temperature.