Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Photoresist coat (Shipley 1827)
Batch size 1
Material Shipley 1827
Sides processed either
Thickness 2.7 µm
Wafer size
Wafer size
Equipment Solitec photoresist spinner
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, no-flat
Wafer holder
Device that holds the wafers during processing.
 metal chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 quartz (single crystal), silicon on insulator, silicon, Pyrex (Corning 7740)
Wafer thickness
List or range of wafer thicknesses the tool can accept
 100 .. 1000 µm