Process Hierarchy

  HMDS Prime
Ambient to which substrate is exposed during processing
Material HMDS
Wafer size
Wafer size
Equipment Headway spinner
Equipment characteristics:
Batch sizes 100 mm: 1, 150 mm: 1, 200 mm: 1, 75 mm: 1
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
vacuum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
glass (category), silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1000 µm
  • diluted HMDS adhesion promoter spun at 5krpm or concentrated vapor immersion