Process Hierarchy

on front
  X-ray front-front align
Alignment tolerance
Registration of CAD data to features on wafer
2 µm
Sides processed either
Wafer size
Wafer size
Equipment X-ray beam line
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
no-flat, 1-flat, 2-flat, notched
Wafer holder
Device that holds the wafers during processing.
stainless steel
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
glass (category), metal (category), Pyrex (Corning 7740), quartz (single crystal), silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
500 .. 1000 µm