Process Hierarchy

on front
  Silicon dioxide LPCVD
Materialsilicon dioxide
Refractive index1 .. 4Thickness0 .. 50 µm
Process characteristics:
Amount of material added to a wafer
Amount of material added to a wafer, must be 0 .. 4 µm
0 .. 4 µm
Wafers have duv photoresist
Wafers have duv photoresist*
yes no
Wafers metallized
Wafers metallized*
yes no
Batch sizes 100 mm: 24, 150 mm: 11
Excluded materials gold
Material silicon dioxide
Wafer size
Wafer size