Process Hierarchy

on front
  Aluminum wet etch
Materialaluminum
Process characteristics:
Depth
Depth of material removed by etch process
Depth*
Depth of material removed by etch process, must be 0 .. 1 µm
0 .. 1 µm
Batch size 12
Mask materials
Materials that can be used to mask etching.
photoresist (category)
Selectivity
Primary material removal rate divided by removal rates of secondary materials (i.e., factors by which primary material is removed faster than secondary materials)
aluminum: 1
Wafer size
Wafer size