Process Hierarchy

  Anodic bonding (vacuum, with alignment)
Alignment type
Method used to align materials to be bonded.
optical
Batch size 2
Bonded materials
Pair of materials bonded by this process
silicon, Pyrex (Corning 7740), glass (Hoya)
Pressure
Pressure of process chamber during processing
0.1 mTorr
Wafer size
Wafer size