Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Maskless photolithography (front-front align) (Shipley 1827)
on front
  1 Photoresist coat (Shipley 1827)
MaterialShipley 1827
  2 Photoresist softbake
on front
  3 Maskless Alignment
on front
  4 Maskless Exposure
  5 Photoresist develop (Shipley 1827)
MaterialShipley 1827
on front
  6 Microscope inspection
Process characteristics:
Resist thickness
thickness of photoresist.
Resist thickness
thickness of photoresist., must be 3 .. 24 µm
3 .. 24 µm
Batch size 1
Material Shipley 1827
Sides processed either
Wafer size
Wafer size
Comments:
  • $100.00 setup fee.
  • Minimum of 4 wafers.