Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Anodic bonding (air, with alignment)
  1 Megasonic clean
  2 Anodic bonding (air, with alignment)
Alignment type
Method used to align materials to be bonded.
 optical
Ambient
Ambient to which substrate is exposed during processing
 air
Batch size 2
Bonded materials
Pair of materials bonded by this process
 glass (Hoya), Pyrex (Corning 7740), silicon
Pressure
Pressure of process chamber during processing
 1 atm
Wafer size
Wafer size
Comments:
  • Note that 150 mm wafer is not cleaned completely in this tool. The megasonic head does not go to the wafer edge, so only about 80% of the wafer is cleaned from the center out.