Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Backside protect (NR1-6000PY)
on back
  1 Photoresist coat (NR1-6000PY)
MaterialNR1-6000PY
  2 Photoresist softbake II
Materialphotoresist (category)
Process characteristics:
Resist thickness
Resist thickness*
must be 5 .. 11 µm
5 .. 11 µm
Material NR1-6000PY
Max field size 200 mm
Wafer diameter(s)
List or range of wafer diameters the tool can accept
 75 .. 200 mm
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 glass (category), silicon, silicon on insulator
Wafer size
Wafer size
Comments:
  • Please select this module if the other side of the wafer needs to be protected during the front-to-back alignment step of a contact lithography module.