Process Hierarchy

on front
  Backside protect (NR1-6000PY)
Materialphotoresist (category)
Process characteristics:
Resist thickness
Resist thickness*
must be 5 .. 11 µm
5 .. 11 µm
Material NR1-6000PY
Max field size 200 mm
Wafer diameter(s)
List or range of wafer diameters the tool can accept
75 .. 200 mm
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
glass (category), silicon, silicon on insulator
Wafer size
Wafer size
  • Please select this module if the other side of the wafer needs to be protected during the front-to-back alignment step of a contact lithography module.