Process Hierarchy

  SEM analysis Down
a new system will be installed soon.
Process characteristics:
Material(s) to inspect.
Material(s) to inspect.
Batch size 1
Process duration 1 .. 4 hour
Equipment JEOL SEM
Equipment characteristics:
MOS clean yes
Piece dimension
Range of wafer piece dimensions the equipment can accept
10 .. 20 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
circular, irregular, other, rectangular, triangular shard
Piece thickness
Range of wafer piece thickness the equipment can accept
100 .. 1000 µm
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
alumina, ceramic, Corning 1737, fused silica, gallium arsenide, glass (Hoya), glass-ceramic, indium phosphide, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon on insulator, silicon on sapphire
  • Site will provide estimate of time to complete, but will have to adjust final charges if times are longer or shorter than estimate. Additional time will not be used without checking with customer.
  • Hourly cost includes up to 8 pictures on black and white polaroid film. Additional pictures will require customer to purchase additional packs of film (8 pictures) at $23 per pack.