Iridium DC-magnetron sputter: View
Low-stress SiN deposition
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
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Iridium DC-magnetron sputter
Amount of material added to a wafer
Amount of material added to a wafer, must be 0 .. 3000 Å
0 .. 3000 Å
Ambient to which substrate is exposed during processing
Pressure of process chamber during processing
25 .. 49 mm
50 .. 75 mm
Fixtures exist to support 50mm, 75mm, and 100mm wafers. There is a small edge-exclusion along the entire wafer edge for these fixtures. Up to eight wafers may be sputtered with these fixtures.
Clamping fixtures exist to support irregular substrates from 25mm to 75mm wide. Sputter is blocked where clamping fingers hold sample.
For irregular samples 25mm to near 50mm wide up to 16 samples may be run per batch.
For irregular samples 50mm to 75mm wide only 8 samples can be run per batch.
100 mm: 8, 25 .. 49 mm: 16, 50 .. 75 mm: 8
Device that holds the wafers during processing.
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
glass (category), silicon
List or range of wafer thicknesses the tool can accept
100 .. 1000 µm
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