Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  E-beam Evaporation (Ti)
Process characteristics:
Thickness
Thickness of material to be deposited.
Thickness*
Thickness of material to be deposited., must be 100 .. 5000 Å
100 .. 5000 Å
Material titanium
Sides processed either
Temperature 25 °C
Wafer size
Wafer size
Equipment Evaporator
Equipment characteristics:
Batch sizes 100 mm: 8, 150 mm: 4
MOS clean no
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 quartz (fused silica), Pyrex (Corning 7740), silicon on insulator, silicon, ceramic
Wafer thickness
List or range of wafer thicknesses the tool can accept
 300 .. 1000 µm