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Fusion pre-bonding : View
Process Hierarchy
Bonding
Anodic bonding
Fusion bonding
Glass frit bonding
Miscellaneous bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
Fusion pre-bonding
Process characteristics:
Bonding force
Bonding force
N
must be 0 .. 7000 N
0 .. 7000 N
Pressure
Pressure of process chamber during processing
Pressure
mTorr
Pressure of process chamber during processing, must be 0.075 .. 2250 mTorr
0.075 .. 2250 mTorr
Second substrate side bonded
Second substrate side bonded
*
back
front
Substrate side bonded
Substrate side bonded
*
back
front
Temperature
Temperature
°C
must be 25 .. 550 °C
25 .. 550 °C
Alignment tolerance
Registration of CAD data to features on wafer
1 µm
Alignment type
Method used to align materials to be bonded.
optical
Batch size
2
Second substrate diameters
100 mm
Second substrate geometry
wafer
Second substrate material
silicon
Second substrate thickness
100 .. 1000 µm
Wafer holder
Device that holds the wafers during processing.
teflon chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon
Wafer size
Wafer size
100 mm
150 mm
Equipment
EVG 501 Bonder
No organic material allowed in this equipment.
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat
Wafer thickness
List or range of wafer thicknesses the tool can accept
100 .. 3000 µm