Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Glass frit printing/firing
Alignment tolerance
Registration of CAD data to features on wafer
 10 µm
Min feature size 150 µm
Second substrate diameter 100 mm
Second substrate material Pyrex (Corning 7740)
Second substrate thickness 300 .. 1000 µm
Temperature 400 °C
Wafer size
Wafer size
Equipment screen printer
Equipment characteristics:
Batch sizes 100 mm: 1
MOS clean no
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, no-flat, notched
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 Pyrex (Corning 7740), silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
 300 .. 1000 µm