Process Hierarchy

  Dehydration & vapor prime
Ambient to which substrate is exposed during processing
Pressure of process chamber during processing
5 mmHg
Sides processed both
Temperature 150 °C
Wafer size
Wafer size
Equipment Vapor Priming Oven
Equipment characteristics:
Batch sizes 100 mm: 25, 125 mm: 25, 150 mm: 25
MOS clean no
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer holder
Device that holds the wafers during processing.
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
alumina, BK7, Borofloat (Schott), ceramic, copper, Corning 1737, Foturan (Schott), fused silica, gallium arsenide, gallium phosphide, germanium, glass (Hoya), glass-ceramic, indium phosphide, lithium niobate, other, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon carbide, silicon germanium, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1000 µm