Process Hierarchy

on front
  G-line photoresist coat (AZ4000)
Process characteristics:
must be 1.3 .. 20 µm
1.3 .. 20 µm
Sides processed either
Wafer size
Wafer size
Equipment MTI Target Track resist coater
Equipment characteristics:
Batch sizes 100 mm: 1, 125 mm: 1, 150 mm: 1, 200 mm: 1, 75 mm: 1
MOS clean no
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer holder
Device that holds the wafers during processing.
vacuum chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
alumina, BK7, Borofloat (Schott), ceramic, copper, Corning 1737, Foturan (Schott), fused silica, gallium arsenide, gallium phosphide, germanium, glass (Hoya), glass-ceramic, indium phosphide, lithium niobate, other, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon carbide, silicon germanium
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 1000 µm