Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Platinum Evaporation with Adhesion Layer
  1 Piranha clean
  2 Buffered Oxide Etch
on front
  3 E-beam Evaporation (Cr)
Materialchromium
on front
  4 E-beam Evaporation (Pt)
Materialplatinum
on front
  5 Stylus profilometer step measurement
Depth100 µm
Process characteristics:
Adhesion layer material
Adhesion layer material*
Perform clean
Perform clean*
yes no
Perform hf dip
Perform hf dip*
yes no
Perform stylus profilometry
Perform stylus profilometry*
yes no
Thickness
Thickness*
must be 100 .. 1500 Å
100 .. 1500 Å
Material platinum
Wafer size
Wafer size