on front G-line photoresist hardbake (AZ4000) |
|
| Duration |
20 min |
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| Materials |
AZ 4330, AZ 4620 |
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| Sides processed |
either |
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| Temperature |
125 °C |
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| Wafer size |
|
|---|
| Equipment |
Fisher oven |
| Equipment characteristics: |
| Batch sizes |
100 mm: 25, 125 mm: 25, 150 mm: 25 |
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| MOS clean |
no |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
Borofloat (Schott), ceramic, Corning 1737, Foturan (Schott), Pyrex (Corning 7740), quartz (fused silica), silicon, silicon on insulator |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 1000 µm |
|---|
