Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  Sputter deposition (Varian)
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  1 Titanium DC-magnetron sputtering (Varian)
Materialtitanium
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  2 Platinum DC-magnetron sputtering (Varian)
Materialplatinum
Process characteristics:
Adhesion layer material
Adhesion layer material*
Adhesion layer thickness
If no adhesion layer will be used, enter 0 for this field.
Adhesion layer thickness*
If no adhesion layer will be used, enter 0 for this field. , must be 0 .. 50 nm
0 .. 50 nm
Material
Material*
Perform sheet resistance measurement
Perform sheet resistance measurement*
yes no
Thickness
Allowed thickness ranges:
Pt: 0 .. 0.35um
Ta: 0 .. 0.05um
Ti: 0 .. 0.05um
Thickness*
Allowed thickness ranges: Pt: 0 .. 0.35um Ta: 0 .. 0.05um Ti: 0 .. 0.05um, must be 0 .. 1 µm
0 .. 1 µm
Wafer size
Wafer size
Comments:
  • Allowed thickness ranges: (please contact for thicker depositions)
  • Pt: 0 .. 0.35um
  • Ta: 0 .. 0.05um
  • Ti: 0 .. 0.05um