Process Hierarchy

  Image reverse
Ambient to which substrate is exposed during processing
Duration 45 min
Materials AZ P4400, AZ 4620
Sides processed both
Temperature 90 °C
Wafer size
Wafer size
Equipment Yes 310 oven
Equipment characteristics:
Batch sizes 100 mm: 25, 150 mm: 25, 75 mm: 25
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, no-flat, notched
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
fused silica, Pyrex (Corning 7740), silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 1000 µm
  • Negative resist profile ideal for lift-off operations.