|
| Duration |
30 s |
|---|
| Feature geometry Shape of feature with dimensions characterized by the minimum feature size |
line |
|---|
| Field geometry Shape of field with dimensions characterized by the maximum field size |
circle |
|---|
| Max field size |
150 mm |
|---|
| Sides processed |
either |
|---|
| Wafer size |
|
|---|
| Equipment |
ABM Contact aligner |
| Equipment characteristics: |
| Batch sizes |
100 mm: 1, 150 mm: 1, 200 mm: 1, 25 mm: 1, 50 mm: 1, 75 mm: 1 |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
|---|
| Wafer holder Device that holds the wafers during processing. |
vacuum chuck |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |
|---|
| Comments: |
|
