Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Polyimide deposition and pattern
Batch sizes 100 mm: 12, 150 mm: 12
Material PI2771
Min feature size 10 µm
Photoresist polarity negative
Temperature 350 °C
Thickness 5 .. 6 µm
Wafer size
Wafer size
Equipment
Comments:
  • PI-2771 is a NEGATIVE tone photodefinable polyimide.
  • Processing steps are as follows:
    1. Dehydration bake: 30 min in VWR oven
    2. Manual PR spin coat
    3. Softbake: 90s at 90 C
    4. Lithography Exposure - KS Aligner
    5. Post-Exposure Bake
    6. Develop - G-line PR developer
    7. Cure - Oven at 375C, 60 min