Process Hierarchy

on front
  Photoresist develop (automated)
Agent that reacts with masking layer (e.g., photoresist) to etch it selectively.
MIF300 developer
Material photoresist (category)
Process duration 30 .. 60 s
Primary material removal rate divided by removal rates of secondary materials (i.e., factors by which primary material is removed faster than secondary materials)
photoresist (category): 1
Sides processed either
Wafer size
Wafer size
Equipment ACS200 coater/developer
  • Automated coater and developer. Also does vapor HMDS, and hotplate bakes.
Equipment characteristics:
Batch sizes 100 mm: 1, 150 mm: 1
MOS clean yes
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon on insulator, silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
200 .. 800 µm