Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  G-line BCB coat (BCB 4000)
Process characteristics:
Thickness
Thickness*
must be 3 .. 20 µm
3 .. 20 µm
Materials BCB 4024-40, BCB 3022-63, BCB 4026-46
Sides processed either
Wafer size
Wafer size
Equipment MTI BCB coater
Equipment characteristics:
Batch sizes 100 mm: 10, 125 mm: 10, 150 mm: 10
MOS clean no
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, notched, no-flat
Wafer holder
Device that holds the wafers during processing.
 plastic chuck
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon, sapphire, quartz (single crystal), silicon germanium, Foturan (Schott), quartz (fused silica), fused silica, ceramic, glass-ceramic, silicon on insulator, alumina, glass (Hoya), silicon on sapphire, Corning 1737, Borofloat (Schott), Pyrex (Corning 7740), silicon carbide
Wafer thickness
List or range of wafer thicknesses the tool can accept
 300 .. 1100 µm
Comments:
  • Benzocyclobutene (BCB) -based polymer dielectrics
  • CYCLOTENE* Advanced Electronics Resins from The Dow Chemical Company are high-purity polymer solutions that have been developed for microelectronics applications. The resins are derived from B-staged bisbenzocyclobutene (BCB) monomers and are formulated as high-solids, low-viscosity solutions.
  • Notable properties of the resins include:
  • * Low dielectric constant
    * Low loss at high frequency
    * Low moisture absorption
    * Low cure temperature
    * High degree of planarization
    * Low level of ionics
    * High optical clarity
    * Good thermal stability
    * Excellent chemical resistance
    * Good compatibility with various metallization systems
  • The resins are available in photosensitive and dry-etch grades.
  • See its properties at:
    http://www.dow.com/cyclotene/over.htm