Process Hierarchy

on front
  G-line BCB cure
Duration 5 hour
Materials BCB 4024-40, BCB 3022-63, BCB 4026-46
Sides processed either
Temperature 210 °C
Wafer size
Wafer size
Equipment BCB cure oven
Equipment characteristics:
Batch sizes 100 mm: 25, 125 mm: 25, 150 mm: 25
MOS clean no
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer holder
Device that holds the wafers during processing.
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
silicon germanium, silicon, silicon on insulator, indium phosphide, glass-ceramic, glass (Hoya), Foturan (Schott), germanium, Borofloat (Schott), quartz (single crystal), lithium niobate, Pyrex (Corning 7740), quartz (fused silica), ceramic, nickel, titanium, gallium phosphide, Corning Eagle 2000, Corning 1737, sapphire, fused silica, silicon carbide, silicon on sapphire, alumina, gallium arsenide
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 1100 µm