Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  NanoGetter deposition and patterning
  1 Shadow mask-making
on front
  2 NanoGetter sputter deposition
Process characteristics:
Maximum step hight
The maximum depth of cavities or through holes.
Maximum step hight*
The maximum depth of cavities or through holes., must be 0 .. 500 µm
0 .. 500 µm
Patterning Method
the preferred method to be used for patterning the blanket nanogetter film. Please note that if the maximum step hight on the surface is > 30um, then shadow masking will be automatically selected.
Patterning Method*
the preferred method to be used for patterning the blanket nanogetter film. Please note that if the maximum step hight on the surface is > 30um, then shadow masking will be automatically selected.
Thickness
Thickness*
must be 5 .. 500 nm
5 .. 500 nm
Material NanoGetter
Comments:
  • This module requires a mask for the Nanogetter patterning.