Process Hierarchy

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  NanoGetter deposition and patterning
Process characteristics:
Maximum step hight
The maximum depth of cavities or through holes.
Maximum step hight*
The maximum depth of cavities or through holes., must be 0 .. 500 µm
0 .. 500 µm
Patterning Method
the preferred method to be used for patterning the blanket nanogetter film. Please note that if the maximum step hight on the surface is > 30um, then shadow masking will be automatically selected.
Patterning Method*
the preferred method to be used for patterning the blanket nanogetter film. Please note that if the maximum step hight on the surface is > 30um, then shadow masking will be automatically selected.
Thickness
Thickness*
must be 5 .. 500 nm
5 .. 500 nm
Material NanoGetter
Comments:
  • This module requires a mask for the Nanogetter patterning.