Process Hierarchy

on front
  Titanium DC-magnetron sputtering
Process characteristics:
Amount of material added to a wafer
Amount of material added to a wafer, must be 0.01 .. 0.2 µm
0.01 .. 0.2 µm
Ambient to which substrate is exposed during processing
Deposition rate
Rate at which material is added to a wafer
0.0144 µm/min
Material titanium
Pressure of process chamber during processing
5 mTorr
Sides processed either
Uniformity -0.05 .. 0.05
Wafer size
Wafer size
Equipment DC magnetron
Equipment characteristics:
Batch sizes 150 mm: 3
Wafer geometry
Types of wafers this equipment can accept
1-flat, 2-flat, notched, no-flat
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
Pyrex (Corning 7740), quartz (single crystal), Borofloat (Schott), silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
300 .. 1000 µm
Extra terms