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About MEMS
Solder bonding: View
Process Hierarchy
Bonding
Anodic bonding
Fusion bonding
Glass frit bonding
Miscellaneous bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at
engineering@mems-exchange.org
or call us at (703) 262-5368
Solder bonding
Process characteristics:
Alignment tolerance
Tolerance of alignment if needed.
Alignment tolerance
*
µm
Tolerance of alignment if needed. , must be 5 .. 200 µm
5 .. 200 µm
Alignment type
Method used to align materials to be bonded.
Alignment type
*
manual
optical
unaligned
Method used to align materials to be bonded.
Ambient
Ambient to which substrate is exposed during processing
vacuum
Material
gold
Temperature
350 .. 450 °C
Equipment