Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
  Solder bonding
Process characteristics:
Alignment tolerance
Tolerance of alignment if needed.
Alignment tolerance*
Tolerance of alignment if needed. , must be 5 .. 200 µm
5 .. 200 µm
Alignment type
Method used to align materials to be bonded.
Alignment type*
Method used to align materials to be bonded.
Ambient
Ambient to which substrate is exposed during processing
 vacuum
Material gold
Temperature 350 .. 450 °C
Equipment