Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Solder deposition
Process characteristics:
Thickness
Thickness of film to be deposited
Thickness*
Thickness of film to be deposited, must be 1 .. 100 µm
1 .. 100 µm
Material gold
Sides processed either
Equipment